》》 Dimension : 2887(L) x 2300(W) x 2175(H) mm

》》 Panel :

         * Meterial : Etching PCB

         * Input Substrate temperature : Below 40°C

         * Size Max : 542.0(W) x 620.0(L)mm  /  Min : 500(W)ｘ600(L)mm

         * Thickness : 0.05mm ~1.0 mm

         * Weight : Less than 2.5kg

         * Warpage : 0.05% or less of the substrate's diagonal dimension

》》 Fiim : 

         * Type : Roll type 3inch bobbin

         * Thickness : PET 38um, Adhesive 15um

         * Width : 490mm~542mm 

          * DIA : Less than Max. 200 Ø

          * Adhesive power : Less than 100g/㎠±50

》》 Hot roll :

          * Pressurization system : organic connection between upper and lower units

          * Speed : 56.0m/min

          * Dimension : Ø70

          * Temperature deviation : ±1°C

          * Coated material Silicon : Silicon 70° / 3T

          * Heater : Cartridge Heater 1.5kw

 》》 Precision Productivity : 

          * Front / Rear : Repeated lamination accuracy: ±1.0 mm

          * Cycle time : 30pcs/hour

 》》 System :

          * Control : PLC Control

          * Barcode scan : Scanner installation:

                             Consultation with manufacturer on location of installation

          * Temp control : PID Control & ON/OFF type

          * Interface : Further discussion

          * Operation control : Touch Monitor

          * Air Port : 7 Bar & Ø12 8ea + 1ea(spare)

             * Electrics : AC220v , 50~60Hz , 3Phase  

             * SECS GEM